GALAXY

BATCH WAFER PLATFORM

GALAXY BATCH WAFER PLATFORM

GALAXY BATCH WAFER PLATFORM

With the Galaxy batch wafer processing, we combined years of experience with batch wafer processing with the cutting edge of process control typically only found on single wafer tools.

Additionally, this platform is suited to grow with your process needs and both enables you to start prototype application as well as run mass production processes.

MODULAR DESIGN

The modular approach to the batch tool gives you all the potential configurations that satisfy your processing requirements. From a single chamber manual tool, to a two, four, or even eight chamber fully automated tool, with a mix of solvent or acid processing chambers, the basic tool remains the same, and layers of functionality are added on.

Best of all, within the same tool you can use carriers for manual cassette loading, and change over to guardian carriers for full automation. By changing the carrier you can also easily run different substrate sizes.

ADDITIONAL FEATURES

An additional feature is the adding on of immersion tanks to allow the electro-less deposition of metals. Our Galaxy-EL features pre-treatment, rinse-dry batch chambers as well as the tanks necessary to deposit metals very thin and very homogeneously, while offering superior bath life, minimal drag out and excellent uniformity.

GALAXY CUSTOMER ADDED VALUES

  • Identical chambers for manual and fully automated tools in the modular platform
  • Outstanding automation reliability and speed
  • Customized to our customer’s needs
  • Possibility of processing more than one substrate size per chamber with change of carrier
  • Electroless plating can be added optionally to the Galaxy Platform
  • Upgrade- and future-proof
  • Established high-throughput processing chambers

GALAXY HIGHLIGHTS

  • Processing of 3” to 300 mm substrates
  • Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber
  • Industry 4.0 ready – control and monitor all process parameters similar to a single wafer tool
  • Etch uniformity 3% or better
  • Online dosing system
  • Online chemical monitoring
  • Online gas detection for safety
  • End-point detection for many etch processes

APPLICATIONS

SURFACE PREPARATION

  • Cleaning
  • Resist stripping acid
  • Resist stripping solvent
  • Polymer removal
  • O3 clean
  • Lift off
  • Alu etch
  • Cu etch
  • UBM etch
  • Si etch
  • SiO2 etch
  • Ni etch
  • Sacrificial layer etch
  • Wafer thinning
  • Damage removal
  • HF Vapor
  • Au etch
  • Ga etch
  • Glass etch